MECHANIC XG Series 183°C Tin Solder Paste
MECHANIC XG Series 183°C Tin Solder Paste (XG50 / XGSP80 / XGZ40)
The MECHANIC XG Series 183°C Tin Solder Paste is a high-performance soldering solution designed for precision electronics work, including SMD soldering, BGA reballing, IC repair, and PCB rework applications. Engineered with a eutectic Sn63/Pb37 alloy composition, this solder paste offers a consistent melting point of 183°C, ensuring smooth solder flow, strong joint formation, and reliable conductivity.
The XG series is widely trusted by professionals in mobile repair, electronics manufacturing, and rework stations due to its excellent wetting performance, minimal residue, and stable viscosity. Its fine particle structure enables precise application even on densely packed PCB components.
Why Choose MECHANIC XG Series?
The MECHANIC XG series combines precision, reliability, and ease of use, making it a preferred choice for both professionals and hobbyists. Whether you are working on fine-pitch SMD boards or complex BGA repairs, these solder pastes deliver consistent results with minimal effort.
Key Features
| Eutectic Alloy Composition (Sn63/Pb37) | Provides a sharp melting point at 183°C for uniform soldering without partial melting. |
| Excellent Wettability & Flow | Ensures strong, reliable solder joints with smooth spreading on pads and components. |
| Low Residue & Clean Finish | Reduces post-solder cleaning requirements and improves overall PCB reliability. |
| Fine Particle Size | Suitable for high-precision applications including BGA, QFN, and micro SMD components. |
| Stable Viscosity | Maintains consistency during storage and application for controlled dispensing. |
| Wide Application Compatibility | Ideal for use with hot air stations, reflow ovens, and manual soldering processes. |
Variants Overview
XG50 |
Standard solder paste for general SMD repair and PCB rework Balanced viscosity and flow performance Typically available in ~35g packaging |
XGSP80 |
Enhanced formulation for industrial and heavy-duty repair applications Improved stability and solder joint strength Larger quantity packaging (~60g) suitable for frequent use |
XGZ40 |
Syringe-based design with precision dispensing Ideal for fine-pitch components, mobile repair, and IC work Comes with applicator/pusher for controlled usage |
Applications
| Mobile phone PCB repair |
| BGA chip reballing and rework |
| SMD component soldering |
| IC repair and replacement |
| LED and microelectronics assembly |
| Professional electronics servicing and prototyping |
Technical Specifications
| Alloy Type | Sn63 / Pb37 |
| Melting Point | 183°C |
| Form | Paste |
| Flux Type | Rosin-based / No-clean (variant dependent) |
| Storage | Cool and dry conditions recommended |
Package Content
1x Solder Paste (XG50 / XGSP80 / XGZ40)
Original: $6.88
-70%$6.88
$2.06
Description
MECHANIC XG Series 183°C Tin Solder Paste (XG50 / XGSP80 / XGZ40)
The MECHANIC XG Series 183°C Tin Solder Paste is a high-performance soldering solution designed for precision electronics work, including SMD soldering, BGA reballing, IC repair, and PCB rework applications. Engineered with a eutectic Sn63/Pb37 alloy composition, this solder paste offers a consistent melting point of 183°C, ensuring smooth solder flow, strong joint formation, and reliable conductivity.
The XG series is widely trusted by professionals in mobile repair, electronics manufacturing, and rework stations due to its excellent wetting performance, minimal residue, and stable viscosity. Its fine particle structure enables precise application even on densely packed PCB components.
Why Choose MECHANIC XG Series?
The MECHANIC XG series combines precision, reliability, and ease of use, making it a preferred choice for both professionals and hobbyists. Whether you are working on fine-pitch SMD boards or complex BGA repairs, these solder pastes deliver consistent results with minimal effort.
Key Features
| Eutectic Alloy Composition (Sn63/Pb37) | Provides a sharp melting point at 183°C for uniform soldering without partial melting. |
| Excellent Wettability & Flow | Ensures strong, reliable solder joints with smooth spreading on pads and components. |
| Low Residue & Clean Finish | Reduces post-solder cleaning requirements and improves overall PCB reliability. |
| Fine Particle Size | Suitable for high-precision applications including BGA, QFN, and micro SMD components. |
| Stable Viscosity | Maintains consistency during storage and application for controlled dispensing. |
| Wide Application Compatibility | Ideal for use with hot air stations, reflow ovens, and manual soldering processes. |
Variants Overview
XG50 |
Standard solder paste for general SMD repair and PCB rework Balanced viscosity and flow performance Typically available in ~35g packaging |
XGSP80 |
Enhanced formulation for industrial and heavy-duty repair applications Improved stability and solder joint strength Larger quantity packaging (~60g) suitable for frequent use |
XGZ40 |
Syringe-based design with precision dispensing Ideal for fine-pitch components, mobile repair, and IC work Comes with applicator/pusher for controlled usage |
Applications
| Mobile phone PCB repair |
| BGA chip reballing and rework |
| SMD component soldering |
| IC repair and replacement |
| LED and microelectronics assembly |
| Professional electronics servicing and prototyping |
Technical Specifications
| Alloy Type | Sn63 / Pb37 |
| Melting Point | 183°C |
| Form | Paste |
| Flux Type | Rosin-based / No-clean (variant dependent) |
| Storage | Cool and dry conditions recommended |
Package Content
1x Solder Paste (XG50 / XGSP80 / XGZ40)
